We are continuously committed to the optimization of the wafer production process, pursuing excellence in every step of the process, from the purification of silicon raw materials and the directional growth of crystals to wafer dicing (slicing), precision polishing and quality inspection.

Utilizing advanced laser technology, chemical processing methods, automated production lines, and a strict quality management system, we continue to make breakthroughs with the aim of producing wafers with larger sizes, smaller feature sizes, and lower defect rates.

This is not only a pursuit of engineering innovation, but also to meet the growing demand for high-performance chips and to promote the progress of the entire electronics industry.