sic chips

sic chips

 Technical Challenges of 8-inch SiC Substrate Production

Ensuring material properties and uniformity across the entire 8-inch SiC substrate is technically challenging and requires precise control during the manufacturing process.

Finally, scaling up to 8-inch SiC substrates while maintaining high material quality and yield is economically challenging due to the complexity of the manufacturing process and cost factors.


Addressing these technical challenges is critical to driving the widespread use of 8-inch SiC substrates in high-performance power and optoelectronic devices.

Through continued technology innovation and process optimization, we are confident that we can overcome these challenges and provide the semiconductor manufacturing industry with higher quality and larger size SiC substrates.

sic chips

what is silicon substrate