silicon substrate suppliers
the preparation and processing of silicon carbide single crystal substrate wafer
In order to reduce the cost of manufacturing multiple wafers, it is necessary to obtain a larger number of chips from a wafer.
However, since the chip must have straight edges, the wafer formed at the edge of the wafer is usually incomplete.
In order to fully utilize the wafer area, manufacturers need to carefully plan the preparation process to ensure that sufficient edges are retained while maximizing chip yield.
silicon substrate suppliers
the nature of the silicon atomic arrangement has a significant impact on the structural and electronic properties of the device.
Therefore, manufacturers also need to consider the orientation of the silicon crystals when preparing wafers on silicon carbide single-crystal substrates. By precisely controlling the orientation of the silicon crystals, the path of the transported ions can be determined, thus optimizing the performance of the device.
