In daily life, people may inadvertently come into contact with silicon wafers, highly refined rounded sheets with mirror-like surfaces that have achieved an extremely high degree of flatness.

The excellent thermal properties of silicon wafers ensure their stable performance in electronic devices:

The linear coefficient of thermal expansion (0 to 300°C) is around 3-3.5 ppm/°C, which means it adapts well to temperature changes.
The strain point is located at 650-700°C, indicating that the wafer resists deformation below this temperature.
The annealing point is between 700-750°C, a temperature range where the wafer can remove internal stresses and maintain structural integrity.

Their extreme purity, virtually free of impurities, is a key factor in ensuring reliable and consistent semiconductor performance, making them an ideal substrate for manufacturing modern chips.

The fact that they are Tiny irregularities in the surface are designed for specific technical applications.
Silicon wafers are produced using a variety of advanced technologies, each designed to produce high-quality silicon wafers with specific properties and specifications.

Silicon is abundant in nature, and its unique semiconducting properties make it a star material in electronics and technology.

By describing silicon wafers in this way, readers will realize that they are not only the cornerstone of technological progress, but that the complexity of the manufacturing process and the properties of the material itself make them an indispensable part of modern electronic devices.