silicon wafer size
During the production of silicon wafers, the addition of dopants, impurity elements such as aluminum, boron, nitrogen, indium, and gallium that can significantly alter the electronic properties of silicon, is carefully controlled to meet the needs of specific applications.
silicon wafer size
In terms of technical specifications, the diversity of silicon wafers is reflected in the different diameters and thicknesses available to accommodate a wide range of manufacturing needs:
Diameters cover a range from 2 inches to 12 inches.
Thicknesses, on the other hand, are customized to meet specific customer requirements.
Surface finishes include DSP, SSP, DSL and many others to ensure a high quality surface.
The key flatness metric, TTV (Total Thickness Variation), is tightly controlled at the micron level, with the highest standard being <1um.
Bow and warpage are also precisely controlled to ensure wafer stability.
Surface roughness Ra is kept at an extremely low level, down to 0.1nm, to ensure ultra-smooth characteristics.
Among the special indications, ultra-flat, ultra-thin and ultra-smooth glass wafers demonstrate cutting-edge manufacturing capabilities to meet extreme application requirements. This process is critical to the performance of the final product, ensuring that the wafers are adaptable to a wide range of uses, from low-power microprocessors to high-efficiency solar cells.
