Silicon wafers are superbly prepared with a mirror-smooth surface and subtle surface irregularities are kept to a very low level, making them one of the flattest man-made objects in the world.

This characteristic is critical to maintaining the performance of semiconductor devices. At the same time, wafers require a high level of cleanliness in their preparation, and we ensure that they are highly pure and free of impurities through strict production environmental controls and processes.

Silicon is prepared in a variety of ways. During the wafer growth process, dopants such as aluminum, boron, nitrogen, indium, and gallium can be introduced to modify the electronic properties of silicon, depending on the needs of the application.

The use of these dopants determines whether the semiconductor is intrinsic or degenerate, i.e., they determine whether the silicon wafer will act as an n-type or p-type semiconductor.

Differences in doping levels during fabrication allow semiconductor materials to achieve fine tuning between conductivity and insulation, which is key to the functional diversity of modern electronic devices.

Simplified semiconductors with a high degree of doping are mainly used as conductors, while non-intrinsic semiconductors with a low degree of doping maintain good insulating properties.
In short, as the heart of modern technology, the silicon wafer’s precision manufacturing process and unique physicochemical properties make it a bridge between the real and virtual worlds.

We are committed to providing customers with high-quality silicon wafer products, promoting the development of the semiconductor industry, and contributing to the construction of a smarter and more efficient society.

Translated with DeepL.com (free version)